Hier finden Sie eine Übersicht der hier verwendeten Begriffe und Abkürzungen sowie eine kurze Erklärung zur Bedeutung.
| Kürzel | Erklärung |
|---|---|
| HMD oder THD | Durchsteckmontage |
| SMT | Oberflächenmontage |
| PCB | Schaltungsträger (gedruckte Schaltung) |
| BE | Bauelement |
| Kürzel | Erklärung | Art |
|---|---|---|
| µBGA | Micro Ball Grid Array | SMT |
| ASIC | Application Specific Integrated Circuit | BE |
| BGA | Ball Grid Array | SMT |
| C-Flat Pack | Ceramic Flat Pack | SMT |
| C-LCC | Ceramic Leaded Chip Carrier | SMT |
| CMC | Ceramic Multilayer Capacitor | SMT |
| COB | Chip on Board | SMT |
| C-PGA | Ceramic Pin Grid Array | HMT/THD |
| CSP | Chip Scale Package | - |
| DIP | Dual Inline Package | HMT/THD |
| DRAM | Dynamic Random Access Memory | BE |
| FC | Flip Chip | SMT |
| FCIP | Flip Chip in Package | - |
| FCO | Flip Chip on Board | SMT |
| FPC | Flexible Printed Circuit | PCB |
| LB | Lead Bonding | - |
| LF | Lead Frame | - |
| OSC | Odd Shaped Component | BE |
| MCM | Multi Chip Module | SMT |
| MID | Molded Interconnection Device | PCB |
| RCC | Resin Coated Copper | PCB |
| PCB | Printed Circuit Board | PCB |
| P-LCC | Plastic Leaded Chip Carrier | SMT |
| P-QFP | Plastic Quad Flat Pack | SMT |
| P-SO | Plastic Small Outline | SMT |
| P-TSOP | Plastic Thin Small Outline Package | SMT |
| SIP | Single Inline Package | HMT/THD |
| SMD | Surface Mount Device | SMT |
| SMT | Surface Mount Technology | SMT |
| SO | Small Outline | SMT |
| SOD | Small Outline Diode | SMT |
| SOJ | Small Outline J-Lead | SMT |
| SOT | Small Outline Transistor | SMT |
| SSOP | Shrink Small Outline Package | SMT |
| TAB | Tape Automated Bonding | SMT |
| TCP | Tape Carrier Package | SMT |
| THP | Through Hole Package | HMT/THD |
| THT | Through Hole Technology | HMT/HMD |
| TO | Transistor Outline | BE |
| TSOP II | Thin Small Outline Package, Type II | SMT |
| UTSOP | Ultra Thin Small Outline Package | SMT |
| ZIP | Zigzag Inline Package | HMT/THD |